Inkjet solution for PCB manufacturing uses Agfa’s DiPaMat ink to win the 2019 IPC APEX Innovation Award
PCB manufacturing is rapidly transforming from analogue lithographic film and chemistry based processes to digital inkjet technologies to reduce waste and increase production flexibility and efficiency. One of the new processes inkjets Agfa’s DiPaMat SolderMask in multiple layers exactly where needed in the necessary thickness on the board’s circuitry, to achieve the required physical [...]